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Strong order intake ASML eases concerns about slowing AI investments - Engineers Online

Translated title. Original: Sterke orderinstroom ASML neemt zorgen over afzwakkende AI-investeringen weg - Engineers Online

ASML faces growing demand for chip-making equipment and is revising production plans upward. The company aims to expand EUV and DUV capacity, with 2027 and 2028 targets under consideration, driven by AI and advanced semiconductors; 2026 Q3 revenue hit a record €11.7B with €5B net profit.

Siemens and NVIDIA speed up AI chip lithography by 12x ...

Siemens and NVIDIA are expanding their collaboration to accelerate computational lithography for next-gen AI chips by integrating cuLitho with Calibre, achieving up to 12x faster full-chip OPC and 10x–17x speedups in lithography simulations, enabling scalable, precise patterning for High-NA EUV and faster AI hardware manufacturing.

HBM for Nvidia: Samsung forced to subcontract lithography to ...

Translated title. Original: HBM pour Nvidia : Samsung contraint de sous-traiter la gravure à ...

Nvidia pushes a unified HBM memory architecture and dictates a joint technical roadmap to its suppliers. Samsung agrees to manufacture Nvidia's base die using TSMC's 3nm process, marking a historic first collaboration with TSMC, while Samsung maintains its own independent production for standard HBM and considers its own foundry capacity to meet demand.

ASML vs. Nikon vs. Canon Lithography: EUV, DUV and NIL

The document compares ASML, Nikon, and Canon lithography technologies, noting that they use different patterning methods (EUV, DUV, and NIL) and that selection depends on specific layer requirements, throughput, and fab context rather than a single universal metric. It emphasizes that chips use multiple layers and that lithography choices are layer- and process-specific, with no one-size-fits-all winner.

Samsung and TSMC: Nvidia apparently forces HBM cooperation

Translated title. Original: Samsung und TSMC: Nvidia erzwingt offenbar HBM-Kooperation

Samsung and Nvidia reportedly seek to shift NVHBM base-die production to TSMC's 3nm process, with Nvidia pushing a unified 3nm standard across Samsung, SK Hynix, and Micron. Samsung would still handle HBM4/4E memory layers, while its own 2nm base-die is under development as an alternative. Validation could be simplified by a common process, but capacity and verification risk depend on TSMC. Independent measurements of performance gains are not yet available.

China’s new 0.1-nanometre electron microscope ready to challenge US and Japan | South China Morning Post

China aims to commercialise a 200 kV transmission electron microscope with 0.1 nm information resolution, challenging US and Japanese leaders. Developed by Hefei-based CIQTEK, the device matches top models and marks a shift from R&D to commercialisation to cut imports for critical technologies such as chip manufacturing.

Samsung to produce AMD and Nvidia chip parts at second Texas plant

Samsung announces Taylor Fab 2 in Texas to manufacture HBM base dies for AMD and Nvidia, with production aimed for 2030 and a 2.7 million sq ft facility. The plan pairs Texas-based base dies with South Korea DRAM cores, expands US capacity, and positions Samsung as a competitor to TSMC while signaling both domestic sovereignty and transpacific value chains.

Apple will invest up to USD $100 million in American titanium for the iPhone Duo - DiarioBitcoin

Translated title. Original: Apple invertirá hasta USD $100 millones en titanio estadounidense para el iPhone Duo - DiarioBitcoin

Apple will buy up to $100 million in titanium from Perryman over three years for the iPhone Duo and other products, with at least 80% recycled and processing in Pennsylvania; the deal supports Apple's broader $600 billion U.S. manufacturing and R&D commitment and includes other local supplier agreements, including Qnity Electronics and a new TSMC chip production plan in Arizona. The iPhone Duo starts at $1,999 with delivery slates extended to January.

ASML stock: 2026 revenue outlook raised

Translated title. Original: ASML Aktie: Umsatzausblick für 2026 angehoben

ASML reported strong third-quarter results and raised its 2026 revenue outlook to €44 billion–€45 billion. The article says investors should also watch how the company protects its technology and handles suspended union talks and internal change.

Short-selling firm Culper claims Cerebras wafer-scale chip lifespan is only about two years, far below what the IPO filing claimed | TechNews Tech News

Translated title. Original: 做空機構 Culper 指 Cerebras 晶圓級晶片壽命僅約兩年，遠低於 IPO 文件宣稱 | TechNews 科技新報

Culper Research accuses Cerebras Systems of wafer-scale chips with 1.4–2.3 year lifespans, far shorter than Cerebras' IPO claim of 3–5 years, and alleges design and material shortcomings. Cerebras faced investor scrutiny as Culper's report, claims of external parts, and alleged high-power patchwork routines are highlighted, with stock reaction and no immediate public rebuttal at report time.